Grain refinement of tough pitch copper by electromagnetic vibrations during solidification

Materials Transactions

Volumn 47, Issue 7, 2006, Pages 1793-1797

  Mizutani, Yoshiki ^a,c   Miwa, Kenji ^a   Tamura, Takuya ^a   Nakai, Yoshihiro ^b   Otsuka, Yasuyuki ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

^c Industrial Technology Center   (Japan)

Author keywords

Electromagnetic vibrations; Grain refinement; Pure copper; Vibration frequency

Indexed keywords

ELECTRIC FIELDS; ELECTROMAGNETISM; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MAGNETIC FIELDS; SOLIDIFICATION;

ELECTROMAGNETIC VIBRATIONS; GRAIN REFINEMENT; PURE COPPER; VIBRATION FREQUENCY;

COPPER;

EID: 33748562531     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.47.1793     Document Type: Conference Paper

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