Dynamic interfacial debonding initiation induced by an incident crack

International Journal of Solids and Structures

Volumn 43, Issue 21, 2006, Pages 6535-6550

  Wang, Ping ^a   Xu, L Roy ^a  

^a VANDERBILT UNIVERSITY   (United States)

Author keywords

Dynamic fracture; High speed photography; Interface debonding; Interfacial strength

Indexed keywords

CRACK INITIATION; DEBONDING; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; STRESS ANALYSIS; STRESS INTENSITY FACTORS; TENSILE STRENGTH;

ANALYTICAL PREDICTIONS; COOK-GORDON MECHANISMS; DEBONDING INITIATION; INTERFACE DEBONDING;

CRACK PROPAGATION;

EID: 33748535716     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2006.01.006     Document Type: Article

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