Acoustic thermography: Vibrational modes of cracks and the mechanism of heat generation

AIP Conference Proceedings

Volumn 760, Issue , 2005, Pages 624-631

  Rothenfusser, M ^a   Homma, C ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33748523788     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.1916733     Document Type: Conference Paper

References (7)

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3. R.B. Mignogna, R.E. Green, Jr., J.C. Duke, Jr., E.G. Henneke, II, and K.L. Reifsnider, Ultrasonics 19, 159 (1981).
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5. L.D. Favro, Xiaoyan Han, Zhong Ouyang, Gang Sun, Hua Sui, and R.L. Thomas, Review of Scientific Instruments 71, 2418 (2000).
6. Xiaoyan Han, L.D. Favro, Zhong Ouyang, and R.L. Thomas, Journal of Adhesion 76, 151 (2001).
7. Xiaoyan Han, L.D. Favro, Zhong Ouyang, and R.L. Thomas, in Review of Progress in Quantitative Nondestructive Evaluation, Vol. 21, eds. D.O. Thompson and D.E. Chimenti, AIP CP552, New York, 2002, pp. 552-557.