Applications of CE alloys in defense, aerospace, telecom and other electronic markets

Microwave Journal

Volumn 49, Issue 8, 2006, Pages 150-163

  Jacobson, David M ^a   Ogilvy, Andrew J W ^a   Leatham, Alan G ^a  

^a Sandvick Osprey Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BASE PLATE MATERIALS; CERAMIC CIRCUIT BOARDS; COEFFICIENT OF THERMAL EXPANSION(CTE); CONTROLLED EXPANSION (CE) ALLOYS;

AEROSPACE INDUSTRY; CERAMIC MATERIALS; ELECTRONICS INDUSTRY; HEAT SINKS; MICROWAVES; TELECOMMUNICATION INDUSTRY;

ALLOYS;

EID: 33748470699     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (1)

1. nd Advanced Technology Workshop on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications, Baltimore, MD, 29 March 2004.