A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector

IEEE Transactions on Nuclear Science

Volumn 53, Issue 4, 2006, Pages 2296-2302

  Campbell, M ^a   Aglieri Rinella, G ^a   Arnau Izquierdo, G ^a   Gys, T ^a   Kanaya, N ^a   Newby, C ^b   Piedigrossi, D ^a   Riedler, P ^a   Salmi, J ^c   Salonen, J ^c   Savolainen Pulli, S ^c   Somerville, L ^b   Suni, I ^c   Vahanen, S ^c   Wyllie, K ^a  

^a CERN   (Switzerland)

^b UNIVERSITY OF OXFORD   (United Kingdom)

^c VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Photodetectors; Radiation detectors

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; ENCAPSULATION; FABRICATION; IMAGE ANALYSIS; PHOTONS; SENSITIVITY ANALYSIS; THERMAL EFFECTS;

BUMP-BONDING TECHNIQUES; CERAMIC CARRIERS; CHERENKOV RADIATIONS; HYBRID PIXEL DETECTORS;

PHOTODETECTORS;

EID: 33748359509     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2006.880537     Document Type: Conference Paper

References (11)

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