Wettability and spreading kinetics of molten aluminum on copper-coated ceramics

Journal of Materials Science

Volumn 41, Issue 16, 2006, Pages 5081-5087

  Leon C A ^a   Mendoza Suarez, G ^b   Drew, R A L ^b  

^a UNIVERSIDAD MICHOACANA DE SAN NICOLÁS DE HIDALGO   (Mexico)

^b MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CONTACT ANGLE; COPPER; DIFFUSION; ELECTROLESS PLATING; MOLTEN MATERIALS; REACTION KINETICS; WETTING;

COPPER-COATED CERAMICS; EQUILIBRIUM CONTACT ANGLES; MOLTEN ALUMINUM; WETTABILITY;

ALUMINUM COMPOUNDS;

EID: 33748338159     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-0443-7     Document Type: Conference Paper

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