Effect of duplex aging on microstructure and properties of 7050 aluminium alloy

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 6, 2006, Pages 958-963

  Tian, Fu Quan ^a   Cui, Jian Zhong ^a  

^a NORTHEASTERN UNIVERSITY   (China)

Author keywords

7050 aluminium alloys; Conductivity; Duplex aging; Extruded plate; Precipitates

Indexed keywords

AGING OF MATERIALS; EFFECTS; ELECTRIC CONDUCTIVITY; MICROSTRUCTURE; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

7050 ALUMINIUM ALLOYS; DUPLEX AGING; EXTRUDED PLATE; PRECIPITATES;

ALUMINUM ALLOYS;

EID: 33748171093     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

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