Adaptive fuzzy process control of integrated circuit wire bonding

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 3, 1999, Pages 184-

  Kinnaird, Clark D ^a   Khotanzad, Alireza ^b  

^a TEXAS INSTRUMENTS   (United States)

^b Southern Methodist University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33748071451     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)