Copper lead frame: an ultimate solution to the reliability of blp package

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 1, 2000, Pages 2-3

  Choi, Kwang Seong ^a   Kang, Teck Gyu ^a   Park, Ik Seong ^a   Le, Jong Hyun ^a   Cha, Ki Bon ^a  

^a Hynix Semiconductor Inc   (South Korea)

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EID: 33747866723     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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