Low-cost direct chip attach: comparison of smd compatible fc soldering with anisotropically conductive adhesive fc bonding

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 1, 2000, Pages 2-

  Haug, Ralf ^a   Behner, Ulrich ^a   Czaya, Claus Peter ^a   Hauschild, F D ^a   Jiang, Hongquan ^a   Kotthaus, Stefan ^a   Kuschel, S ^a   Schuetz, Reiner ^a   Treutler, Christoph P O ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33747856193     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)