Terabus: A chip-to-chip parallel optical interconnect

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn 2005, Issue , 2005, Pages 363-364

  Kash, J A ^a   Doany, F ^a   Kuchta, D ^a   Pepeljugoski, P ^a   Schares, L ^a   Schaub, J ^a   Schow, C ^a   Trewhella, J ^a   Baks, C ^a   Kwark, Y ^a   Schuster, C ^a   Shan, L ^a   Patel, C ^a   Tsang, C ^a   Rosner, J ^a   Libsch, F ^a   Budd, R ^a   Chiniwalla, P ^a   Guckenberger, D ^a   Kucharski, D ^a   Dangel, R ^b   Offrein, B ^b   Tan, M ^c   Trott, G ^c   Lin, D ^c   Tandon, A ^c   Nystrom, M ^c   more..

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM RESEARCH ZURICH   (Switzerland)

^c AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LIGHT TRANSMISSION; MICROPROCESSOR CHIPS; OPTICAL WAVEGUIDES; SIGNAL RECEIVERS;

CHIP-TO-CHIP; PARALLEL OPTICAL INTERCONNECT; TERABUS (CO);

OPTICAL INTERCONNECTS;

EID: 33747782764     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LEOS.2005.1548029     Document Type: Conference Paper

References (9)

1. http://www.llnl.gov/asci/platforms/purple/index.html
2. Alan F. Benner, Michael Ignatowski, Jeffrey Kash, Daniel M. Kuchta, Mark Ritter, "Exploitation of optical interconnects in future server architectures", IBM J. of Research and Development, in press.
3. D. Kuchta, et. al, "120-Gb/s VCSEL-Based Parallel-Optical Interconnect and Custom 120-Gb/s Testing Station", IEEE Journal of Lightwave Technology, vol. 22, pp.2200-2212, 2004.
4. Brian E. Lemoff, et. al, "MAUI: Enabling Fiber-to-the-Processor With Parallel Multiwavelength Optical Interconnects," IEEE Journal of Lightwave Technology, vol. 22, pp.2043-2054, 2004.
5. D. Kucharski et. al, "A 20Gb/s VCSEL Driver with Pre-Emphasis and Regulated Output Impedance in 0.13μm CMOS," IEEE Intl. Solid-State Circuits Conf., San Francisco, CA, USA, Feb. 2005.
6. D. Guckenberger et. al, "IV, 10mW, 10Gb/s CMOS Optical Receiver Front-End," IEEE RFIC Symposium, Long Beach, CA, USA, June 2005.
7. C. Patel et al., "Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring, and Through Cavity for Parallel Optical Transceiver", Proc. of 55th Electron. Comp. and Technol. Conf., Orlando, FL, USA, 2005
8. F. E. Doany, et. al, "Measurement of optical dispersion in multimode polymer waveguides", 2004 Digest of the LEOS Summer Topical Meetings: Optical Interconnects.
9. Helmut Albrecht, et. al, "New-Generation Interconnect", OSA Topical Meeting on Information Photonics, Charlotte, NC, June 2005.