On the operation of a press pack IGBT module under short circuit conditions

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 433-440

  Gunturi, Satish ^a   Schneider, Daniel ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

Author keywords

High voltage direct current (HVDC); Insulated gate bipolar transistor (IGBT); Intermetallics; Liquid metal corrosion; Power electronics packaging; Press pack modules; Short circuit failure mode

Indexed keywords

CORROSION; ELECTRIC CONVERTERS; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; FAILURE ANALYSIS; INTERMETALLICS; LIQUID METALS; SHORT CIRCUIT CURRENTS;

HIGH-VOLTAGE DIRECT CURRENT; LIQUID METAL CORROSION; POWER ELECTRONICS PACKAGING; PRESS PACK MODULES; SHORT CIRCUIT FAILURE MODE;

INSULATED GATE BIPOLAR TRANSISTORS;

EID: 33747585846     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875090     Document Type: Article

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