A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging

Journal of Microelectromechanical Systems

Volumn 15, Issue 4, 2006, Pages 849-858

  Stark, Brian H ^a,b   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

Author keywords

Electroplated nickel films; MEMS packaging; Solder sealing; Thin film; Vacuum packaging

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATED PRODUCTS; MICROMACHINING; SILICON WAFERS; SOLDERING; THIN FILMS;

MICROELECTROCMECHANICAL SYSTEMS (MEMS); MICROMACHINED SILICON WAFER; SOLDER SEALING; VACUUM PACKAGES;

MICROELECTROMECHANICAL DEVICES;

EID: 33747515229     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.879812     Document Type: Article

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