A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact

Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts

Volumn 2005, Issue , 2005, Pages 224-231

  Monnier, A ^a,b   Froidurot, B ^b   Jarrige, C ^b   Meyer, R ^a   Teste P ^a  

^a UNIV PARIS SUD   (France)

^b SCHNEIDER ELECTRIC   (France)

Author keywords

Ag; Electrical Contact; OFHC Cu; Simulation; Sphere Plane

Indexed keywords

MATERIAL PROPERTIES; OFHC CU; SPHERE-PLANE;

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; SILVER; THERMAL EFFECTS;

ELECTRIC CONTACTS;

EID: 33747436592     PISSN: 03614395     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HOLM.2005.1518248     Document Type: Conference Paper

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