Experience in fabrication of multichip-modules for the ATLAS pixel detector

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 565, Issue 1, 2006, Pages 309-313

  Fritzsch, T ^a   Jordan, R ^a   Topper M ^a   Roder J ^a   Kuna, I ^a   Lutz, M ^a   Defo Kamga, F ^a   Wolf, J ^a   Ehrmann, O ^a   Oppermann, H ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

ATLAS; Bumping technology; Multi chip module; Pixel detector

Indexed keywords

DETECTORS; ELECTROPLATING; FLIP CHIP DEVICES; PARTICLE DETECTORS; THERMAL CYCLING;

ATLAS PIXEL DETECTORS; BUMPING TECHNOLOGY; KNOWN GOOD DIE (KGD); THERMAL AGING;

MULTICHIP MODULES;

EID: 33747203727     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2006.05.010     Document Type: Article

References (7)

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