Curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone/polypyrrole/polymer electrolyte composites

Journal of Applied Polymer Science

Volumn 101, Issue 5, 2006, Pages 2754-2764

  Chiu, Hsien Tang ^a   Wu, Jyh Horng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Composites; Curing behavior; Intermolecular interaction; Polymer electrolyte; Polypyrrole; Silicone

Indexed keywords

COMPOSITE MATERIALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; ELECTROLYTES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HARDNESS TESTING; MECHANICAL PROPERTIES; MOLECULAR STRUCTURE; MORPHOLOGY; RHEOMETERS; SCANNING ELECTRON MICROSCOPY; SILICONES;

CURING BEHAVIOR; INTERMOLECULAR INTERACTION; INTERPENETRATING NETWORK; POLYMER ELECTROLYTES;

POLYPYRROLES;

COMPOSITE; CURING; ELECTROLYSIS; MECHANICAL PROPERTY; POLYMER BLEND; POLYPYRROLE; SILICONE;

EID: 33747091313     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.21334     Document Type: Article

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