An integrated system for setting the optimal parameters in IC chip-package wire bonding processes

International Journal of Advanced Manufacturing Technology

Volumn 30, Issue 3-4, 2006, Pages 247-253

  Hou, Tung Hsu ^a   Chen, Shyh Huei ^a   Lin, Tzu Yu ^a   Huang, Kun Ming ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

Artificial neural networks (ANN); Genetic algorithms (GAs); Response surface method (RSM); Taguchi method; Wire bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; GENETIC ALGORITHMS; MULTIVARIABLE CONTROL SYSTEMS; NEURAL NETWORKS; OPTIMAL CONTROL SYSTEMS; WIRE;

PARAMETER DESIGN PROBLEMS; RESPONSE SURFACE METHOD (RSM); TAGUCHI METHOD; WIRE BONDING;

INTEGRATED CIRCUITS;

EID: 33746844629     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-005-0083-0     Document Type: Article

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