Research present state and development trend of heat-resisting thermosetting resin adhesives

Cailiao Gongcheng/Journal of Materials Engineering

Volumn , Issue SUPPL., 2006, Pages 417-422

  Wang, Ding ^a   Jiang, Min Tao ^a,b   Zheng, Dian Mo ^b   Cheng, Bin ^a   Huang, Zhao ^a  

^a INSTITUTE OF APPLIED CHEMISTRY   (China)

^b NANCHANG UNIVERSITY   (China)

Author keywords

Heat resisting; Research and development; Thermosetting resin

Indexed keywords

EID: 33746831565     PISSN: 10014381     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (28)