Microstructure development and properties of alumina-Ti aluminide interpenetrating composites

Current Applied Physics

Volumn 6, Issue 3, 2006, Pages 444-447

  Han, Ching Zen ^a,b   Brown, Ian W M ^a   Zhang, D L ^b  

^a CALLAGHAN INNOVATION   (New Zealand)

^b UNIVERSITY OF WAIKATO   (New Zealand)

Author keywords

High energy milling; Hot pressing; Interpenetrating network; Pressureless sintering

Indexed keywords

ALUMINUM COMPOUNDS; ARGON; HEAT TREATMENT; HOT PRESSING; MECHANICAL ALLOYING; MECHANICAL PROPERTIES; MICROSTRUCTURE; POROSITY; SINTERING;

ALUMINA-TI ALUMINIDE; INTERPENETRATING NETWORK; PRESSURELESS SINTERING; VICKERS HARDNESS;

COMPOSITE MATERIALS;

EID: 33746816636     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2005.11.037     Document Type: Article

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