Finite element simulation for laser direct depositing processes of metallic vertical thin wall parts. I: The simulation for temperature field during depositing processes

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 42, Issue 5, 2006, Pages 449-453

  Shi, Likai ^a   Gao, Shiyou ^b   Xi, Mingzhe ^a   Ji, Hongzhi ^b   Zhang, Yongzhong ^a   Du, Baoliang ^b  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

^b YANSHAN UNIVERSITY   (China)

Author keywords

Depositing process; Finite element simulation; Laser direct deposition; Metallic vertical thin wall sample; Temperature field

Indexed keywords

BLENDING; COOLING; COUPLINGS; ENTHALPY; HEAT CONDUCTION; MELTING; SIMULATION; STAINLESS STEEL; SUBSTRATES; THERMAL CONDUCTIVITY;

COOLING RATE; DEPOSITING PROCESS; ENTHALPY POTENTIAL METHOD; FINITE ELEMENT MODEL; FINITE ELEMENT SIMULATION; HEAT CONTENT; LASER DIRECT DEPOSITION; MELTING POOL; METALLIC VERTICAL THIN WALL SAMPLE; SOLID LIQUID COUPLING; TEMPERATURE FIELD; THERMAL CONDUCTION;

DEPOSITION;

EID: 33746530214     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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