Effect of n-SiO2 on electrodeposition of nickel and chemical bonding interaction between nanoparticles and matrix metal in the composite coating

Acta Chimica Sinica

Volumn 62, Issue 20, 2004, Pages 2010-2014

  Tu, Wei Yi ^a   Xu, Bin Shi ^a   Dong, Shi Yun ^a   Jiang, Bin ^a   Du, Ling Zhong ^a   Hu, Zhen Feng ^a  

^a NATIONAL KEY LABORATORY FOR REMANUFACTURING   (China)

Author keywords

Chemical bonding; Co deposition mechanism; Composite electrodeposition; Nanoparticle

Indexed keywords

EID: 33746488855     PISSN: 05677351     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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