Sub-Kelvin single flux quantum control circuits and multi-chip packaging for supporting superconducting qubit

Journal of Physics: Conference Series

Volumn 43, Issue 1, 2006, Pages 1417-1420

  Yorozu, S ^a,b,d   Miyazaki, T ^b   Semenov, V ^c   Nakamura, Y ^b,d   Hashimoto, Y ^a   Hinode, K ^a   Sato, T ^a   Kameda, Y ^a   Tsai, S ^b,d  

^a SUPERCONDUCTIVITY RESEARCH LABORATORY   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^c STONY BROOK UNIVERSITY   (United States)

^d NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33746321254     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/43/1/347     Document Type: Article

References (7)

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2. Yoshikawa N and Kato Y 1999 Reduction of Power Consumption of RSFQ Circuits by Inductance-Load-Biasing Superconductor Sci. Technol. 12 782
3. Sandell R, Akerling G and Smith A 1995 Multi-Chip Packaging For High Speed Superconducting Circuits IEEE Trans. Appl. Superconductivity 5 3160
4. Hansen M and Anderko K 1958 Constitution of Binary Alloys (New York: McGraw-Hill Book Company)
5. Hashimoto Y, Yorozu S, Satoh T and Miyazaki T 2005 Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps Applied Phys. Lett. 87 022502
6. Hatano Y, Nagaishi H, Nakahara K and Kawabe U 1992 Performance Analysis of the Josephson dc Flip-Flop IEEE Trans. Appl. Superconductivity 2 148
7. Nagasawa S, Hashimoto Y, Numata H and Tahara S 1995 A 380ps, 9.5mW Josephson 4-Kbit RAM Operated at a High Bit Yield IEEE Trans. Appl. Superconductivity 5 2447