Generation of copper nanoparticles during alkaline etching of an Al-30 at.%Cu alloy

Corrosion Science

Volumn 48, Issue 8, 2006, Pages 1874-1884

  Liu, Y ^a   Arenas, M A ^a   Skeldon, P ^a   Thompson, G E ^a   Habazaki, H ^b   Shimizu, K ^c   Bailey, P ^d   Noakes, T C Q ^d  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

^b HOKKAIDO UNIVERSITY   (Japan)

^c KEIO UNIVERSITY   (Japan)

^d DARESBURY LABORATORY   (United Kingdom)

Author keywords

A. Aluminium; A. Copper; A. Intermetallics; C. Etching

Indexed keywords

ALKALINITY; ALUMINUM; COPPER; ETCHING; NANOSTRUCTURED MATERIALS; SPUTTER DEPOSITION; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ALKALINE ETCHING; DEALLOYING; NANOPARTICLES; RUTHERFORD BACKSCATTERING SPECTROSCOPY (RBS);

INTERMETALLICS;

ALKALINITY; ALUMINUM; COPPER; ETCHING; INTERMETALLICS; NANOSTRUCTURED MATERIALS; SPUTTER DEPOSITION; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 33746238705     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2005.07.011     Document Type: Article

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