Packaging technology trends and challenges for system-in-package

IEICE Transactions on Electronics

Volumn E84-C, Issue 12, 2001, Pages 1756-1762

  Dohya, Akihiro ^a  

^a NEC CORPORATION   (Japan)

Author keywords

CSP; Packaging technology; SIP; Soc; System in package

Indexed keywords

EID: 33746165109     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. R.R. Tummla, E.J. Rymaszewski, and A.G. Klopfenstein, Microelectronics Packaging Handbook, Copyright 1997 by Chapman & Hall, New York, NY, 1997.
2. The Semiconductor Industry Association Roadmap, "Internet domain survey," available at http://www.siaj.org/news/22nov99.html, Feb. 2001.
3. R.W. Guernsey, "Semiconductor technology trends and requirements for packaging," PCB & Electric Device Expo., Jan. 2000.
4. "Internet domain survey," available at http://www.su.rcast.u-tokyo.ac.jp/MSIP-lab/, Feb. 2001.