Atomistic simulation of tensile strength and toughness of cracked Cu nanowires

Fatigue and Fracture of Engineering Materials and Structures

Volumn 29, Issue 8, 2006, Pages 615-622

  Luque, A ^a   Aldazabal, J ^a   Martinez Esnaola J M ^a   Sevillano, J Gil ^a  

^a UNIVERSITY OF NAVARRA   (Spain)

Author keywords

Atomistic simulations; Mechanical properties; Micromechanical modelling; Molecular dynamics; Nanowires; Toughness

Indexed keywords

COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; COPPER; CRACKS; DISLOCATIONS (CRYSTALS); FRACTURE TOUGHNESS; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; NANOSTRUCTURED MATERIALS; NUCLEATION; TENSILE STRESS; TWINNING;

ATOMISTIC SIMULATION; COPPER NANOWIRES; CRACK TIP; EMBEDDED-ATOM METHOD;

WIRE;

EID: 33746065294     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2006.01037.x     Document Type: Article

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