Property of nano-SiO2/urea formaldehyde resin

Frontiers of Forestry in China

Volumn 1, Issue 2, 2006, Pages 230-237

  Lin, Qiaojia ^a   Yang, Guidi ^a   Liu, Jinghong ^a   Rao, Jiuping ^a  

^a FUJIAN AGRICULTURE AND FORESTRY UNIVERSITY   (China)

Author keywords

Bonding strength; Free formaldehyde; Nanometer silicon dioxide; Urea formaldehyde (UF) resin; X ray photoelectronic spectrum (XPS)

Indexed keywords

EID: 33746060538     PISSN: 16733517     EISSN: 16733630     Source Type: Journal    
DOI: 10.1007/s11461-006-0024-6     Document Type: Article

References (14)

1. Cao M.-S., Guan C.-B. and Xu J.-Q., Introduction of Nano-material, Harbin: Harbin Institute of Technology Press, 2001, 5-23
2. Du G.-B., Application of mineral filler of urea formaldehyde resin as plywood adhesive, China Adhes., 1995, 4(1): 39-42
3. Gu J.-Y., Adhesive and Coating, Beijing: China Forestry publishing House, 1999, 48-77
4. Levendis D., The correlation of strength and formaldehyde emission with the crystalline amorphous structure of UF resin, Holzforschung, 1992, 46(3): 263-269
5. Liang L., Application of hardener and filler of urea formaldehyde resin adhesive, Mod. Chem. Ind., 1996, (1): 49-50
6. Moulder J.-F., Stickle W.-F. and Sobol R-E., Handbook of X-ray Photoelectron Spectroscopy, USA: Physical Electronics Pub., 1995, 216-239
7. Pampach R. and Haberkc K., Ceramic Powders, Amsterdam: Elsevier Scientific Pub., 1983, 623
8. Tang X.-H., Wood Adhesive, Beijing: Chemical Industry Press, 2002, 1-12
9. Wang S.-M., Xu Z.-X. and Fu J., Preparation Technology of Nano-materials, Beijing: Chemical Industry Press, 2002, 130-144
10. Wang Z.-X., Infrared Spectrum Analysis and Assaying of Polymers, Sichuan: Sichuan University Press, 1989, 176-178, 273
11. Wu G., Token and Application of Material Structure, Beijing: Chemical Industry Press, 2002, 347-393
12. Xu G.-C. and Zhang L.-D., Nano Composite Material, Beijing: Chemical Industry Press, 2002, 1-24, 115-132
13. 2, Wood Ind., 2004a, 18(3): 7-9
14. 2 on the properties of the urea formaldehyde resin, J. Fujian For. Coll., 2004b, 24(2): 114-117