SCOPUS 정보 검색 플랫폼

Volumn 101, Issue 3, 2006, Pages 1787-1792

Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard

Author keywords

Formaldehyde emission; Formaldehyde to urea mole ratio; Particleboard; Thermal behavior; Urea formaldehyde resin

Indexed keywords

ABSORPTION; ACTIVATION ENERGY; CHEMICAL BONDS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; UREA;

FORMALDEHYDE EMISSION; FORMALDEHYDE TO UREA MOLE RATIO; PARTICLEBOARD; THERMAL BEHAVIOR; UREA-FORMALDEHYDE RESIN;

FORMALDEHYDE;

ABSORPTION; CALORIMETRY; CURING; FORMALDEHYDE; SWELLING; SYNTHESIS; SYNTHETIC RESIN; TEMPERATURE EFFECT;

EID: 33746046042 PISSN: 00218995 EISSN: 10974628 Source Type: Journal
DOI: 10.1002/app.23538 Document Type: Article

Times cited : (117)

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