Structure and properties of UHMWPE fiber/carbon fiber hybrid composites

Journal of Applied Polymer Science

Volumn 101, Issue 3, 2006, Pages 1880-1884

  Lu, Sheng Hua ^a   Liang, Guo Zheng ^b   Zhou, Zhi Wei ^a   Li, Fang ^a  

^a SHAANXI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Composites; Fibers; Mechanical properties; Polyethylene

Indexed keywords

BENDING STRENGTH; COMPOSITE MATERIALS; COMPRESSIVE STRENGTH; DYNAMIC MECHANICAL ANALYSIS; ENERGY DISSIPATION; FIBERS; HEAT RESISTANCE; HIGH TEMPERATURE EFFECTS; LAMINATED COMPOSITES; MECHANICAL PROPERTIES; MOLECULAR WEIGHT;

CARBON FIBER CONTENT; DISSIPATION FACTOR; INNER-LAMINAR HYBRID COMPOSITE; INTERLAMINAR SHEAR STRENGTH;

POLYETHYLENES;

CARBON FIBER; COMPOSITE; FIBER PROPERTY; HEAT RESISTANCE; INTERLAMINAR PROPERTY; MECHANICAL PROPERTY; MOLECULAR WEIGHT; POLYETHYLENE FIBER; SHEAR PROPERTY; THERMAL PROPERTY;

EID: 33746035310     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.24071     Document Type: Article

References (14)

1. Chiu, H. T.; Wang, J. H. J Appl Polym Sci 1998, 68, 1387.
2. Ogawa, T.; Mukai, H.; Osawa, S. J Appl Polym Sci 2001, 79, 1162.
3. Sanchez, S.; Picazo, C. J.; Lopez, M. L. J Appl Polym Sci 2001, 79, 1802.
4. Ogawa, T.; Mukai, H.; Osawa, S. J Appl Polym Sci 1999, 71, 243.
5. Zhang, Y. F.; Xiao, C. F.; Jia, G. X.; An, S. L. J Appl Polym Sci 1999, 74, 670.
6. Devaux, E.; Caze, C. Compos Sci Technol 1999, 59, 879.
7. Lu, S. H.; Liang, G. Z.; He, Y. New Chem Mater 2002, 30, 13.
8. Zhang, Z. G.; Zhong, W. H.; Zhang, D. X. J Beijing Univ Aeronaut Astronaut 1999, 25, 499.
9. Silverstein, M. S.; Sadovsky, J.; Alon, D. J Appl Polym Sci 1999, 72, 405.
10. Li, Y.; Xian, X. J.; Choy, C. L. Compos Sci Technol 1999, 59, 13.
11. Ackley, M.; Gao, P. Polymer 1992, 33, 19.
12. He, Y.; Liang, G. Z.; Yang, J. Y. Lu, S. H. Acta Aeronaut Astronaut 2004, 25, 504.
13. Xu, Z.; Cheng, Y. B.; Wei, Z. S. Acta Aeronaut Astronaut 1994, 15, 222.
14. Akay, M. Compos Sci Technol 1993, 47, 419.