Effect of the loading and size of copper particles on the mechanical properties of novel Cu/LDPE composites for use in intrauterine devices

Materials Science and Engineering: A

Volumn 429, Issue 1-2, 2006, Pages 329-333

  Xia, Xianping ^a   Xie, Changsheng ^a   Cai, Shuizhou ^a   Wen, Feng ^a   Zhu, Changhong ^b   Yang, Xiangliang ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Copper microparticles; Copper nanoparticles; Cu LDPE composites; Mechanical properties

Indexed keywords

ADHESION; ELASTIC MODULI; LOW DENSITY POLYETHYLENES; NANOSTRUCTURED MATERIALS; STRESS CONCENTRATION; TENSILE STRENGTH; YIELD STRESS;

INTERFACIAL ADHESION; INTRAUTERINE DEVICES;

COPPER;

ADHESION; COPPER; ELASTIC MODULI; LOW DENSITY POLYETHYLENES; NANOSTRUCTURED MATERIALS; STRESS CONCENTRATION; TENSILE STRENGTH; YIELD STRESS;

EID: 33745949488     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.05.045     Document Type: Article

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