A noninvasive, on wafer method to determine the intrinsic stress of a polymer layer

Experimental Mechanics

Volumn 46, Issue 3, 2006, Pages 307-311

  Conklin, J A ^a   Helffrich, J A ^b   Cohn, R W ^a   Walsh, K W ^a   Cox, H L ^a  

^a UNIVERSITY OF LOUISVILLE   (United States)

^b SOUTHWEST RESEARCH INSTITUTE   (United States)

Author keywords

Diaphragm; Fabrication; MEMS; Testing

Indexed keywords

MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS; WHITE ACOUSTIC NOISE;

INTRINSIC STRESS; LASER VIBROMETER; MEMBRANE INTRINSIC BIAXIAL TENSION;

DIAPHRAGMS;

DIAPHRAGMS; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS; WHITE ACOUSTIC NOISE;

EID: 33745935227     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-006-6415-7     Document Type: Article

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