Stress-impedance effects in sandwiched FeCuNbCrSiB/Cu/FeCuNbCrSiB films

Materials Letters

Volumn 60, Issue 21-22, 2006, Pages 2554-2557

  Chen, Ji An ^a   Ding, Wen ^a   Zhou, Yong ^a   Cao, Ying ^a   Zhou, Zhi Min ^a   Zhang, Ya Min ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

MEMS; Sandwiched FeCuNbCrSiB Cu FeCuNbCrSiB films; Stress impedance

Indexed keywords

IRIDIUM COMPOUNDS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; STRAIN GAGES; STRESS ANALYSIS;

METAL STRAIN GAUGE; MICROELECTROMECHANICAL SYSTEMS (MEMS); STRAIN SENSORS;

THIN FILMS;

EID: 33745846454     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2006.03.065     Document Type: Article

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