-
2
-
-
0032138470
-
Surface micromachining for microelectromechanical systems
-
J.M. Bustillo, R.T. Howe, R. S. Muller, "Surface micromachining for microelectromechanical systems." Proc. IEEE, 1998, 86, 1552-1574.
-
(1998)
Proc. IEEE
, vol.86
, pp. 1552-1574
-
-
Bustillo, J.M.1
Howe, R.T.2
Muller, R.S.3
-
3
-
-
0000832581
-
Process technology for the modular Integration of CMOS and polysilicon microstructures
-
J.M. Bustillo, G. K. Fedder, C.T.-C.Nguyen, R.T. Howe, "Process technology for the modular Integration of CMOS and polysilicon microstructures." Microsys. Technol. 1994, 1, 130-141.
-
(1994)
Microsys. Technol.
, vol.1
, pp. 130-141
-
-
Bustillo, J.M.1
Fedder, G.K.2
Nguyen, C.T.-C.3
Howe, R.T.4
-
5
-
-
0002203496
-
A lownoise digital accelerometer using integrated SOI-MEMS technology
-
M.A. Lemkin, T.N. Juneau, W. A. Clark, T. A. Roessig, T. J. Brosnihan, "A lownoise digital accelerometer using integrated SOI-MEMS technology." In: Proc. Transducers '99; 1999, pp. 1294-1297.
-
(1999)
Proc. Transducers '99
, pp. 1294-1297
-
-
Lemkin, M.A.1
Juneau, T.N.2
Clark, W.A.3
Roessig, T.A.4
Brosnihan, T.J.5
-
6
-
-
84944728136
-
Optical IMEMS - A fabrication process for MEMS optical switches with integrated on-chip electronics
-
T. J. Brosnihan, S. A. Brown, A. Brogan, C. S. Gormley, D. J. Collins, S. J. Sherman, M. Lemkin, N.A. Polce, M.S. Davis, "Optical IMEMS - A fabrication process for MEMS optical switches with integrated on-chip electronics." In: Proc. Transducers '03; 2003, pp. 1638-1642.
-
(2003)
Proc. Transducers '03
, pp. 1638-1642
-
-
Brosnihan, T.J.1
Brown, S.A.2
Brogan, A.3
Gormley, C.S.4
Collins, D.J.5
Sherman, S.J.6
Lemkin, M.7
Polce, N.A.8
Davis, M.S.9
-
7
-
-
0043065292
-
A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS
-
J. Yasaitis, M. Judy, T. Brosnihan, P. Garone, N. Pokrovskiy, D. Sniderman, S. Limb, R. Howe, B. Boser, M. Palaniapan, X. Jiang, S. Bhave, "A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS." In: Proc. SPIE2003, 4979, 145-154.
-
(2003)
Proc. SPIE
, vol.4979
, pp. 145-154
-
-
Yasaitis, J.1
Judy, M.2
Brosnihan, T.3
Garone, P.4
Pokrovskiy, N.5
Sniderman, D.6
Limb, S.7
Howe, R.8
Boser, B.9
Palaniapan, M.10
Jiang, X.11
Bhave, S.12
-
8
-
-
0002939906
-
Fabrication technology for an integrated surface micromachined sensor
-
T. A. Core, W. K. Tsang, S. J. Sherman, "Fabrication technology for an integrated surface micromachined sensor." Solid State Technol. 1993, 39-47.
-
(1993)
Solid State Technol.
, pp. 39-47
-
-
Core, T.A.1
Tsang, W.K.2
Sherman, S.J.3
-
9
-
-
0029489783
-
Embedded micromechanical devices for the monolithic integration of MEMS with CMOS
-
J. Smith, S. Montague, J. Sniegowski, J. Murray, P. McWhorter, "Embedded micromechanical devices for the monolithic integration of MEMS with CMOS." In: Proc. IEEE IEDM '95 1995, pp. 609-612.
-
(1995)
Proc. IEEE IEDM '95
, pp. 609-612
-
-
Smith, J.1
Montague, S.2
Sniegowski, J.3
Murray, J.4
McWhorter, P.5
-
10
-
-
0032206391
-
Integrated micro- Electromechanical sensor development for inertial applications
-
J. J. Allen, R.D. Kinney, J. Sarsfield, M.R. Daily, J.R. Ellis, J.H. Smith, S. Montague, R.T. Howe, B. E. Boser, R. Horowitz, A.P. Pisano, M.A. Lemkin, W. A. Clark, T. Juneau, "Integrated micro- electromechanical sensor development for inertial applications." IEEE Aerospace Electron. Syst. Mag. 1998, 13, 36-40.
-
(1998)
IEEE Aerospace Electron. Syst. Mag.
, vol.13
, pp. 36-40
-
-
Allen, J.J.1
Kinney, R.D.2
Sarsfield, J.3
Daily, M.R.4
Ellis, J.R.5
Smith, J.H.6
Montague, S.7
Howe, R.T.8
Boser, B.E.9
Horowitz, R.10
Pisano, A.P.11
Lemkin, M.A.12
Clark, W.A.13
Juneau, T.14
-
11
-
-
0042284294
-
Full integration of a pressure-sensor system into a standard BICMOS process
-
T. Scheiter, H. Kapels, K.-G. Oppermann, M. Steger, C. Hierold, W.M. Werner, H.-J. Timme, "Full integration of a pressure-sensor system into a standard BICMOS process." Sens. Actuators A 1998, 67, 211-214.
-
(1998)
Sens. Actuators A
, vol.67
, pp. 211-214
-
-
Scheiter, T.1
Kapels, H.2
Oppermann, K.-G.3
Steger, M.4
Hierold, C.5
Werner, W.M.6
Timme, H.-J.7
-
12
-
-
0030282352
-
Laminated high-aspectratio microstructures in a conventional CMOS process
-
G. K. Fedder, S. Santhanam, M.L. Reed, S. C. Eagle, D. F. Guilou, M.S.-C. Lu, L.R. Carley, "Laminated high-aspectratio microstructures in a conventional CMOS process." Sens. Actuators A 1996, 57, 103-110.
-
(1996)
Sens. Actuators A
, vol.57
, pp. 103-110
-
-
Fedder, G.K.1
Santhanam, S.2
Reed, M.L.3
Eagle, S.C.4
Guilou, D.F.5
Lu, M.S.-C.6
Carley, L.R.7
-
13
-
-
0036540106
-
Post-CMOS processing for high-aspect-ratio integrated silicon microstructures
-
H. Xie, L. Erdmann, X. Zhu, K. J. Gabriel, G. K. Fedder, "Post-CMOS processing for high-aspect-ratio integrated silicon microstructures." J. Microelectromechan. Syst. 2002, 11, 93-101.
-
(2002)
J. Microelectromechan. Syst.
, vol.11
, pp. 93-101
-
-
Xie, H.1
Erdmann, L.2
Zhu, X.3
Gabriel, K.J.4
Fedder, G.K.5
-
14
-
-
0037197302
-
Polysilicon: A versatile material for microsystems
-
P. J. French, "Polysilicon: a versatile material for microsystems." Sens. Actuators A 2002, 99, 3-12.
-
(2002)
Sens. Actuators A
, vol.99
, pp. 3-12
-
-
French, P.J.1
-
15
-
-
0030244812
-
The development of a low-stress polysilicon process compatible with standard device processing
-
P. J. French, B. P. van Drieenhuizen, D. Poenar, J.F.L. Goosen, R. Mallee, P.M. Sarro, R. F. Wolffenbuttel, "The development of a low-stress polysilicon process compatible with standard device processing." IEEE J. Microelectromech. Syst. 1996, 5, 187-196.
-
(1996)
IEEE J. Microelectromech. Syst.
, vol.5
, pp. 187-196
-
-
French, P.J.1
Van Drieenhuizen, B.P.2
Poenar, D.3
Goosen, J.F.L.4
Mallee, R.5
Sarro, P.M.6
Wolffenbuttel, R.F.7
-
16
-
-
84858925320
-
-
Coventor, Cary, NC, http://www.coventor.com/
-
-
-
-
17
-
-
84858911312
-
-
Digital Video Broadcast: http://www.dvb.org/
-
-
-
|