Basic studies of overlay performance on immersion lithography tool

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6154 I, Issue , 2006, Pages

  Shiraishi, Ken Ichi ^a   Fujiwara, Tomoharu ^a   Tanizaki, Hirokazu ^a   Ishii, Yuuki ^a   Kono, Takuya ^b   Nakagawa, Shinichiro ^b   Higashiki, Tatsuhiko ^b  

^a NIKON CORPORATION   (Japan)

^b TOSHIBA CORPORATION   (Japan)

Author keywords

Evaporation heat; Immersion lithography; Overlay accuracy; Thermal stabilities; Topcoat; UPW

Indexed keywords

DEGRADATION; EVAPORATION; MATHEMATICAL MODELS; SEMICONDUCTOR MATERIALS; SOLVENTS; THERMODYNAMIC STABILITY;

EVAPORATION HEAT; IMMERSION LITHOGRAPHY; OVERLAY ACCURACY; TOPCOAT; ULTRA PURE WATER (UPW);

PHOTOLITHOGRAPHY;

EID: 33745784816     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656306     Document Type: Conference Paper

References (5)

1. Burn J. Lin, "Immersion lithography and its impact on semiconductor manufacturing", Journal of Microlithography, Microfabrication, and Microsystems, 3, (533), 2004.
2. Soichi Owa, Hiroyuki Nagasaka, Yuuki Ishii, Kenichi Shiraishi and Shigeru Hirukawa, "Full-field exposure tools for immersion lithography", Proc. SPIE 5754, pp. 655-668 (2005).
3. Katsushi Nakano, Shirou Nagaok aand Soichi Owa, "Defectivity data taken with a full-field immersion exposure tool", CD-ROM of the 2nd International Symposium on Immersion Lithography, held in Bruges (IMEC, International SEMATECH, Selete), September (2005).
4. Katsumi Ohmori, Tomoyuki Ando, Hiromitsu Tsuji, Masaaki Yoshida, Keita Ishizuka Tomoyuki Tomoyuki Hirano, and Hiroto Yukawa, "Top coat investigation for immersion Top coat investigation for immersion specific issue prevention", CD-ROM of the 2nd International Symposium on Immersion Lithography, held in Bruges (IMEC, International SEMATECH, Selete), September (2005).
5. Barney M. Cohen, Wayne G. Renken, Paul Miller, "Dynamic in-situ temperature profile monitoring of a deep-UV post-exposure bake process", Proc. SPIE Vol. 4689, p. 1133-1142 (2005).