Influence of mask manufacturing process on printing behavior of angled line structures

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6154 III, Issue , 2006, Pages

  Teuber, Silvio ^a   Dürr, Arndt C ^a   Herguth, Holger ^a   Kunkel, Gerhard ^b   Wandel, Timo ^a   Zell, Thomas ^b  

^a Advanced Mask Technology Centre GmbH and Co KG   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

AIMS; Angled lines; Line edge roughness; Wafer printing

Indexed keywords

APPROXIMATION THEORY; ELECTRON BEAMS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; VECTORS;

AIMS; ANGLED LINES; LINE EDGE ROUGHNESS; WAFER PRINTING;

MASKS;

EID: 33745764804     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.657070     Document Type: Conference Paper

References (3)

1. ITRS 2005 Edition: http://www.itrs.net/Common/2005ITRS/ExecSum2005.pdf
2. Paul C. Allen et al. "ALTA 4700 system mask patterning performance improvements for X-architecture and wafer electrical performance interchangeability with 50kV E-beam", 21st European Mask and Lithography Conference, 2005.
3. Masashi Ataka et al., "CD measurement of angled lines on high-end masks and its calibration method", 25th Annual BACUS Symposium on Photomask Technology, 2005