Coupled temperature, diffusion and squeeze flow model for interfacial healing predictions

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 4, Issue , 2006, Pages 2205-2210

  Grewell, David ^a   Benatar, Avraham ^b  

^a Iowa State University   (United States)

^b The Ohio State University   (United States)

Author keywords

Healing squeeze flow; Molecular diffusion; Welding

Indexed keywords

COUPLED TEMPERATURE; HEALING SQUEEZE FLOW; ISOTHERMAL CONDITIONS; MOLECULAR DIFFUSION; WELD STRENGTH;

DIFFUSION; INTERFACES (MATERIALS); ISOTHERMS; THIN FILMS;

WELDING;

EID: 33745629364     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. DeGennes, P.G., Journal of Chemical Physics Vol. 55, p. 572 (1971)
2. Wool, R., Molecular Aspects of Tack, Rubber Chemistry and Technology, No. 57, 207 (1983)
3. DeGennes, P.G., Physics Today (June 1983), p. 33-39
4. Jud, K., Kausch, H.H. and Williams, J.G., "Fracture Mechanics Studies on Crack Healing and Welding of Polymers", Journal of Material Science, 1981, 16; 204
5. Loos A.C., Dara P.H., 'Thermoplastic Matrix Composites Processing Model", Interm Report 57, NASE Cooperative Agreement NAG-1-343, 1985
6. Wool R., Polymer Interfaces, Structure and Strength, Pg 42-55, Hanser Publications, Munich Germany, 1995, pg 306