ArF processing of 90-nm design rule lithography achieved through enhanced thermal processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 II, Issue , 2006, Pages

  Kagerer, Markus ^a   Miller, Daniel ^a   Chang, Wayne ^b   Williams, Daniel J ^c  

^a FSI International Inc   (United States)

^b UNIVERSITY OF WESTERN ONTARIO   (Canada)

^c SUMIKA Electronic Materials   (United States)

Author keywords

ArF processing; CD uniformity; Chemically amplified photoresist platforms; PEB delay; PEB uniformity; Thermal characterization

Indexed keywords

MATHEMATICAL MODELS; OPTIMIZATION; PROCESS CONTROL; REAL TIME SYSTEMS; THERMAL EFFECTS;

ARF PROCESSING; CD UNIFORMITY; CHEMICALLY AMPLIFIED PHOTORESIST PLATFORMS; PEB DELAY; PEB UNIFORMITY; THERMAL CHARACTERIZATION;

LITHOGRAPHY;

EID: 33745595905     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.659235     Document Type: Conference Paper

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