Pulsed mode operation of strained microelectromechanical resonators in air

Applied Physics Letters

Volumn 88, Issue 25, 2006, Pages

  Cimalla, V ^a   Foerster, Ch ^a   Will, F ^a   Tonisch, K ^a   Brueckner, K ^a   Stephan, R ^a   Mein, M E ^a   Ambacher, O ^a   Aperathitis, E ^b  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b INSTITUTE OF COMPUTER SCIENCE   (Greece)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; DAMPING; NANOTECHNOLOGY; RESONATORS; SILICON CARBIDE;

MAGNETOMOTIVE OPERATION; PULSED MODE OPERATION; QUALITY FACTORS; RESONANT STRUCTURES;

MICROELECTROMECHANICAL DEVICES;

EID: 33745514848     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2213950     Document Type: Article

References (27)

1. Y. Arntz, J. D. Seelig, H. P. Lang, J. Zhang, P. Hunziker, J. P. Ramseyer, H. Meyer, M. Hegner, and Ch. Gerber, Nanotechnology 14, 86 (2003).
2. J. Fritz, M. K. Baller, H. P. Lang, H. Rothuizen, P. Vettiger, E. Meyer, H.-J. Güntherodt, Ch. Gerber, and J. K. Gimzewski, Science 288, 316 (2000).
3. K. L. Ekinci and M. L. Roukes, Rev. Sci. Instrum. 76, 061101 (2005).
4. B. Ilic, H. G. Craighead, S. Krylov, W. Senaratne, C. Ober, and P. Neuzil, J. Appl. Phys. 95, 3694 (2004).
5. B. Ilic, Y. Yang, and H. G. Craighead, Appl. Phys. Lett. 85, 2604 (2004).
6. K. L. Ekcini, X. M. H. Huang, and M. L. Roukes, Appl. Phys. Lett. 84, 4469 (2004).
7. Z. J. Davis and A. Boisen, Appl. Phys. Lett. 87, 013102 (2005).
8. H. P. Lang, R. Berger, F. Battiston, J.-P. Ramsyer, R. Meyer, C. Andreoli, J. Brugger, P. Vettiger, M. Dcspont, T. Mezzacasa, L. Scandella, H.-J. Güntherodt, Ch. Gerber, and J. K. Gimzewski, Appl. Phys. A: Mater. Sci. Process. 66, S61 (1998).
9. H. G. Craighead, Science 290, 1532 (2000).
10. E. Forsen, G. Abadal, S. Ghatnekar-Milsson, J. Teva, J. Verd, R. Sandberg, W. Svendsen, F. Perez-Murano, J. Esteve, F. Campabadal, L. Monelius, N. Barniol, and A. Boisen, Appl. Phys. Lett. 87, 043507 (2005).
11. L. Sekaric, M. Zalalutdinov, R. B. Bhiladvala, A. T. Zehnder, J. M. Parpia, and H. G. Craighead, Appl. Phys. Lett. 81, 2641 (2002).
12. B. Ilic, S. Krylov, K. Aubin, R. Reichenbach, and H. G. Craighead, Appl. Phys. Lett. 86, 193114 (2005).
13. A. Dana, F. Ho, and Y. Yamamoto, Appl. Phys. Lett. 72, 1152 (1998).
14. K. Brueckner, Ch. Foerster, K. Tonisch, V. Cimalla, O. Ambacher, R. Stephan, K. Blau, and M. A. Hein, Proceedings of the 35th European Microwave Conference, Paris, October 2005, Vol. 3, p. 1531.
15. A. N. Cleland, M. Pophristic, and I. Ferguson, Appl. Phys. Lett. 79, 2070 (2001).
16. Y. T. Yang, K. L. Ekinci, X. M. H. Huang, L. M. Schiavone, M. L. Roukes, C. A. Zorman, and M. Mchregany, Appl. Phys. Lett. 78, 162 (2001).
17. Ch. Foerster, V. Cimalla, O. Ambacher, and J. Pezoldt, Mater. Sci. Forum 483-485, 201 (2005).
18. V. Cimalla, J. K. Karagodina, J. Pezoldt, and G. Eichhorn, Mater. Sci. Eng., B 29, 170 (1994).
19. K. Tonisch, V. Cimalla, Ch. Foerster, D. Dontsov, and O. Ambacher, Phys. Status Solidi C 3, 2274 (2006).
20. K. Brueckner, R. Stephan, M. A. Kein, Ch. Foerster, V. Cimalla, and O. Ambacher, Proceedings of the Fifth Workshop on MEMS for Millimeter-WAVE Communications MEMSWAVE 2004, Uppsala, Sweden, 30 June-2 July 2004, p. H5.
21. Ch. Foerster, V. Cimalla, K. Brueckner, V. Lebedev, R. Stephan, M. Hein, and O. Ambacher, Phys. Status Solidi A 202, 671 (2005).
22. T. Ikehara, R. A. F. Zwijze, and K. Ikeda, J. Micromech. Microeng. 11, 55 (2001).
23. J. F. Vignola, J. A. Judge, J. Jarzynski, M. Zalalutdinov, B. H. Houston, and J. W. Baldwin, Appl. Phys. Lett. 88, 041921 (2006).
24. H. Hosaka, K. Itao, and S. Kuroda, Sens. Actuators, A 49, 87 (1995).
25. F. R. Blom, S. Bouwstra, M. Elwenspoek, and J. H. J. Fluitman, J. Vac. Sci. Technol. B 10, 19 (1992).
26. L. D. Landau and E. M. Lifshitz, Fluid Mechanics, Course of Theoretical Physics, 2nd ed. (Pergamon, Oxford, 1963), Vol. 6.
27. Ch. Foerster, V. Cimalla, E. Aperathidis, K. Brueckner, R. Stephan, M. Hein, J. Pezoldt, and O. Ambacher, International Topical Workshop on Heteroepitaxy of 3C-SiC on Silicon and its Application to Sensor Devices HeT-SiC-05, Krippen. 26 April-1 May, Wissenschaftlich-Technische Berichte FZR-433, 2005, pp. 44-49.