Heat transfer modeling for soldering processes of SMD's to printed circuit boards using low inert infrared heaters

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005

Volumn 2005, Issue , 2005, Pages 112-117

  Evstatiev, I ^a   Pencheva, T ^a   Mashkov, P ^a  

^a UNIVERSITY OF RUSE   (Bulgaria)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; HEAT TRANSFER; INFRARED HEATING; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; THERMODYNAMIC PROPERTIES;

ELECTRONIC CONTROL; INFRARED HEATERS; SOLDERING CAMERA; SPECTRAL REGION;

SOLDERING;

EID: 33745450952     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2005.1491013     Document Type: Conference Paper

References (6)

1. J. Howell, R. Buckius, "Fundamentals of engineering thermodynamics", McGraw-Hill, Inc. New York, etc. 1992, pp. 1033.
2. J. Morton, "An industrial oven", GB Pat. 2368629, 2002.
3. K. Takahashi, "Apparatus and method for soldering electronic components to printed circuit boards", USPat. .6,575,352, 2003.
4. R. Siegel, J. Howell, "Thermal radiation heat transfer", Mc Graw-Hill Book Inc. New York, 1972. pp. 905.
5. A.C. Metaxas, "Foundation of Electroheat", John Wiley & sons, Chichester, 2000, pp. 780.
6. th International Spring Seminar on Electronics Technology - ISSE 2004, Sofia, Bulgaria, 2004, pp. 366 - 370.