Bubble leaping and slipping during subcooled boiling on thin wires

International Journal of Thermal Sciences

Volumn 45, Issue 9, 2006, Pages 908-916

  Lu, J F ^a   Peng, X F ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Bubble; Leaping; Slipping; Thermocapillary force; Wire

Indexed keywords

BUBBLE COLUMNS; HEAT TRANSFER; OSCILLATORS (MECHANICAL); THERMOANALYSIS; WIRE MILLS;

BUBBLE; LEAPING; SLIPPING; THERMOCAPILLARY FORCE; WIRES;

BOILING LIQUIDS;

EID: 33745346797     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2005.12.003     Document Type: Article

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