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Volumn 88, Issue 11, 2005, Pages 3116-3124

Measurement of the thermophysical properties of a thermoplastic ceramic paste across its solidification range using power-compensated differential scanning calorimeter

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DRUG PRODUCTS; SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL DIFFUSION; THERMOPLASTICS;

EID: 33745322542     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00568.x     Document Type: Article
Times cited : (5)

References (20)
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  • 2
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    • Cooling behaviour of particle filled polypropylene during injection moulding process
    • B. Weidenfeller, M. Hofer, and F. R. Schilling, "Cooling Behaviour of Particle Filled Polypropylene During Injection Moulding Process," Compos. Pt. A-Appl. Sci. Manuf., 36, 3 (2005).
    • (2005) Compos. Pt. A-Appl. Sci. Manuf. , vol.36 , pp. 3
    • Weidenfeller, B.1    Hofer, M.2    Schilling, F.R.3
  • 4
    • 8644247420 scopus 로고    scopus 로고
    • Heat capacity, thermal conductivity, and thermal expansion of barium titanate-based ceramics
    • Yi He, "Heat Capacity, Thermal Conductivity, and Thermal Expansion of Barium Titanate-Based Ceramics," Thermochim. Acta, 419, 1-2 (2004).
    • (2004) Thermochim. Acta , vol.419 , pp. 1-2
    • He, Y.1
  • 5
    • 0033314362 scopus 로고    scopus 로고
    • Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
    • C. P. Wong and R. S. Bollampally, "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled With Ceramic Particles for Electronic Packaging," J. Appl. Polym. Sci., 74, 14 (1999).
    • (1999) J. Appl. Polym. Sci. , vol.74 , pp. 14
    • Wong, C.P.1    Bollampally, R.S.2
  • 8
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    • R. M. McDonald, Patent No. NZ Patent 294951 (October 1997).
    • R. M. McDonald, Patent No. NZ Patent 294951 (October 1997).
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    • R. Munday, Patent No. US Patent 5720972 (March 1996).
  • 12
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    • Perkin-Elmer Life and Analytical Sciences Inc., Boston, MA
    • Perkin-Elmer Inc., Pyris Software for Windows, ver. 3.81. Perkin-Elmer Life and Analytical Sciences Inc., Boston, MA, 1999.
    • (1999) Pyris Software for Windows, Ver. 3.81
  • 15
    • 33745311981 scopus 로고
    • Transient plane source techniques for thermal-conductivity and thermal-diffusivity measurements of solid materials
    • S. E. Gustafsson, "Transient Plane Source Techniques for Thermal-Conductivity and Thermal-Diffusivity Measurements of Solid Materials," Rev. Sci. Instrum., 62, 3 (1991).
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  • 17
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    • The melting behavior of organic materials confined in porous solids
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    • Modelling the thermal conductivity of starch-water gels
    • M. J. Morley and C. A. Miles, "Modelling the Thermal Conductivity of Starch-Water Gels," J. Food Eng., 33, 1-2 (1997).
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    • Morley, M.J.1    Miles, C.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.