Molecular dynamics simulation of polishing process based on coupling vibrations of liquid

Chinese Journal of Mechanical Engineering (English Edition)

Volumn 19, Issue 1, 2006, Pages 19-24

  Huang, Zhigang ^a   Guo, Zhongning ^a   Cheng, Xing ^a   Yu, Daming ^b   Du, Xue ^b   Li, Rongbing ^b  

^a GUANGDONG UNIVERSITY OF TECHNOLOGY   (China)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Molecular dynamics simulation; Ultra smooth polishing; Ultrasonic vibration

Indexed keywords

ADHESION; COUPLINGS; LIQUIDS; MOLECULAR DYNAMICS; SILICON; ULTRASONICS; VIBRATIONS (MECHANICAL);

ADHESION EFFECT; MOLECULAR DYNAMICS SIMULATION; PARTICLES BOMBARDING; SILICON MONOCRYSTAL SURFACE; TERSOFF POTENTIALS; ULTRA SMOOTH POLISHING; ULTRASONIC VIBRATION;

POLISHING;

EID: 33745291792     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/cjme.2006.01.019     Document Type: Article

References (5)

1. ZHANG Liangchi, TANAKA H. On the mechanics and physics in the nanoindentation of silicon monocrystals[J]. JSME International Journals, 1999, 42(4): 546-559.
2. TERSOFF J. New empirical approach for the structure and energy of covalent systems[J]. Physical Review B (Condensed Matter), 1988, 37(12): 6991-7000.
3. RAPAPORT D C. The art of molecular dynamics simulation[M]. 2nd edition. England: Cambridge University Press, 2004.
4. BIFANO T G, DOW T G, SCATTERGOOD R O. Ductile-regime grinding: a new technology for machining brittle materials[J]. ASME International Journals for Industry, 1991, 113: 184-189.
5. ZARUDI I, ZHANG L C. Subsurface damage in sigle-crystal silicon due to grinding and polishing[J]. Journals of Material Science, 1996, 15: 586-587.