Plasmonics: the next chip-scale technology

Materials Today

Volumn 9, Issue 7-8, 2006, Pages 20-27

  Zia, Rashid ^a   Schuller, Jon A ^a   Chandran, Anu ^a   Brongersma, Mark L ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA PROCESSING; ELECTRONICS PACKAGING; METAL ANALYSIS; NANOSTRUCTURED MATERIALS;

CHIP-SCALE ELECTRONICS; METALLIC NANOSTRUCTURES; PHOTONIC DEVICES; PLASMONICS;

CHIP SCALE PACKAGES;

EID: 33745230127     PISSN: 13697021     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-7021(06)71572-3     Document Type: Article

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