Investigation of trace metals analyses of dry residue on silicon wafer surfaces by TXRF and ICP-MS

Solid State Phenomena

Volumn 76-77, Issue , 2001, Pages 75-80

  Wang, J B ^a   Balazs, M ^a   Pianetta, P ^b   Baur, K ^b   Brennan, S ^b  

^a Balazs Analytical Services   (United States)

^b SLAC NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

Dry Residue; ICP MS; SR TXRF; TXRF; VPD; Wafer surface

Indexed keywords

COPPER; INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRY; MASS SPECTROMETERS; NICKEL; TRACE ELEMENTS;

DRY RESIDUE; ICP-MS; SR-TXRF; TXRF; WAFER SURFACE;

SILICON WAFERS;

EID: 33745222910     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.76-77.75     Document Type: Conference Paper

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