Low-overhead core swapping for thermal management

Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)

Volumn 3471 LNCS, Issue , 2005, Pages 46-60

  Kursun, Eren ^a   Reinman, Glenn ^a   Sair, Suleyman ^b   Shayesteh, Anahita ^a   Sherwood, Tim ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b North Carolina State University   (United States)

^c University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVITY MIGRATION; CORE SWAPPING; TEMPERATURE MANAGEMENT TECHNIQUES; THERMAL EFFICIENCY;

COOLING; ELECTRONICS PACKAGING; ENERGY EFFICIENCY; MICROPROCESSOR CHIPS;

ENERGY MANAGEMENT;

EID: 33745166655     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: 10.1007/11574859_4     Document Type: Conference Paper

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