Effect of annealing treatment on the microstructure and properties of cold-sprayed Cu coating

Journal of Thermal Spray Technology

Volumn 15, Issue 2, 2006, Pages 206-211

  Li, Wen Ya ^a   Li, Chang Jiu ^a   Liao, Hanlin ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b UNIVERSITÉ DE TECHNOLOGIE DE BELFORT MONTBÉLIARD   (France)

Author keywords

Annealing treatment; Cold spraying; Copper (Cu) coating; Electrical resistivity; Microhardness; Microstructure

Indexed keywords

ANISOTROPY; ANNEALING; BONDING; COPPER; CRYSTAL MICROSTRUCTURE; DEPOSITION; ELECTRIC CONDUCTIVITY; GRAIN GROWTH; HIGH TEMPERATURE EFFECTS; MICROHARDNESS; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY);

ANNEALING TREATMENT; COLD SPRAYING; COPPER COATING;

SPRAYED COATINGS;

EID: 33745067714     PISSN: 10599630     EISSN: None     Source Type: Journal    
DOI: 10.1361/105996306X108066     Document Type: Review

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