Engineered wood flooring design using the finite element method

Forest Products Journal

Volumn 56, Issue 5, 2006, Pages 59-65

  Blanchet, Pierre ^a   Cloutier, Alain ^b   Gendron, Guy ^b   Beauregard, Robert ^b  

^a FORINTEK CANADA CORP   (Canada)

^b UNIVERSITÉ LAVAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CUPPING DEFORMATION; GEOMETRICAL PARAMETERS; WOOD FLOORING;

COSTS; FINITE ELEMENT METHOD; STRUCTURAL DESIGN; WOODEN CONSTRUCTION;

WOODEN FLOORS;

CONSTRUCTION COSTS; FLOORS; STRUCTURAL DESIGN;

EID: 33744986973     PISSN: 00157473     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (8)

1. Anonymous. 2003. Statistical report '02. Floor Covering Weekly 52(19).
2. Blanchet, P., A. Cloutier, G. Goudron, and R. Beauregard. 2003. Hygromechanical modelling of layered parquet using the finite element method. In: Proc. of the Second Inter. Conf. of the European Soc. for Wood Mechanics. Lennart Salmen (STF1), ed. Stockholm, Sweden.
3. _, G. Gendron, A. Cloutier, and R. Beauregard. 2005. Numerical prediction of Engineered Wood Flooring Behavior. Wood and Fiber Sci. 37(3):484-496.
4. Bodig, J. and B.A. Jayne. 1993. Mechanics of Wood and Wood Composites. Krieger Publishing Company, Malabar, FL. 712 pp.
5. Dorlot, J.-M., J.-P. Baïlon, and J. Masounave. 1986. Des Matériaux. (Materials). 2nd ed. École Polytechnique de Montreal, Montreal, Quebec, Canada. 467 pp. (in French).
6. Goulet, M. and Y. Fortin. 1975. Mesures du gonflement de l'érable à sucre au cours d'un cycle de sorption d'humidité à 21°C. (Swelling measurement in sugar maple in a sorption cycle at 21°C.) Res. note No 12. Dept. of Wood and Forest Sciences, Université Laval, Quebec, Canada. 49 pp. (in French).
7. Jessome, A.P. 2000. Strength and related properties of woods grown in Canada. Special Publication SP514E. Forintek Canada Corp., Ste.-Foy, QC, Canada. 37 pp.
8. Siau, J.F. 1995. Wood: Influence of moisture on physical properties. Dept. of wood science and forest products, Virginia Tech, Blacksburg, VA. 227 pp.