Development of a novel hybrid aluminum-based composite with enhanced properties

Journal of Materials Processing Technology

Volumn 176, Issue 1-3, 2006, Pages 191-199

  Gupta, M ^a   Lai, M O ^a   Lim, C Y H ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Aluminum; Coefficient of thermal expansion; Composites; Mechanical properties; Microstructure

Indexed keywords

DEPOSITION; ELASTIC MODULI; INTERFACES (MATERIALS); SILICON CARBIDE; SYNTHESIS (CHEMICAL); THERMAL EXPANSION;

ALUMINUM MATRIX INTERFACE; COEFFICIENT OF THERMAL EXPANSION; MELT DEPOSITION;

ALUMINUM COMPOUNDS;

EID: 33744935014     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.03.130     Document Type: Article

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