Layer-transfer process modifications for fabricating hybrid crystal orientation engineered substrates

Proceedings - IEEE International SOI Conference

Volumn 2005, Issue , 2005, Pages 121-122

  Sullivan, Jim ^a   Kirk, Harry R ^a   Kang, Sien ^a   Ong, Philip J ^a   Henley, Francois J ^a  

^a Silicon Genesis Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744771270     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2005.1563560     Document Type: Conference Paper

References (9)

1. V. Moroz et al., Solid State Tech., 77, July 2005.
2. F. J. Henley et al, European Semiconductor, 25, Feb. 2000.
3. Y.C. Liu, paper 9.4, VLSI Tech. Dig., 2004.
4. M. Yang et al., paper 16.1, VLSI Tech. Dig., 2004.
5. M. Yang et al., 453, IEDM 2003.
6. Q. Ouyang, paper 3A-4, VLSI Tech. Dig., 2005.
7. C.D. Sheraw, paper 2.1 VLSI Tech. Dig., 2005.
8. A. Thilderkvist et al, 12, IEEE Int'l SOI Conf., 2000.
9. I. J. Malik et al., in Proc. SiGe: Materials, Processes & Devices Symp., Fall 2004 ECS Mtg.