Contact planarization of sacrificial photoresist for MEMS application

Gongneng Cailiao yu Qijian Xuebao/Journal of Functional Materials and Devices

Volumn 12, Issue 2, 2006, Pages

  Xing, Xiang Long ^a,b   Jiao, Ji Wei ^a   Daffron, Mark ^c   Wang, Yue Lin ^a   Choi, Hyung ^d  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c BREWER SCIENCE INC   (United States)

^d Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

CMP; Contact planarization; Dishing effect; MEMS; Uniformity

Indexed keywords

EID: 33646735161     PISSN: 10074252     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)