The degradation assessment of epoxy/mica insulation under multi-stresses aging

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 13, Issue 2, 2006, Pages 415-422

  Jia, Zhidong ^a   Hao, Yanpeng ^a,c   Xie, Hengkun ^b  

^a TSINGHUA UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aging; Epoxy mica insulation; Interface; Joint time frequency analysis; Ultra wide band partial discharge

Indexed keywords

EPOXY MICA INSULATION; INTERFACE; JOINT TIME-FREQUENCY ANALYSIS; ULTRA-WIDE BAND PARTIAL DISCHARGE;

AGING OF MATERIALS; EPOXY RESINS; INTERFACES (MATERIALS); MICA; NATURAL FREQUENCIES; SCANNING ELECTRON MICROSCOPY; STRESSES;

ELECTRIC INSULATION;

EID: 33646400856     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2006.1624287     Document Type: Article

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